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Intel Xeon Scalable Processors.. Dual Socket P (LGA 3647) supported. CPU TDP support 205W. 3 UPI up to 10.4 GT/s. CPU1: Skylake-F CPU supported
Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz. Up to 2TB 3DS ECC LRDIMM. in 16 DIMM slots
3 PCI-E 3.0 x16. 4 PCI-E 3.0 x8 M.2 Interface: PCIe 3.0 x4 and PCIe 3.0 x4 M.2 Form Factor: 22110 M.2 Key: M-Key (RAID 0.1 support)
Dual LAN with 10GBase-T with Intel X557
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Supermicro X11DPH-T Dual LGA 3647 Sockets Motherboard
$53.99
Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz. Up to 2TB 3DS ECC LRDIMM. in 16 DIMM slots
3 PCI-E 3.0 x16. 4 PCI-E 3.0 x8 M.2 Interface: PCIe 3.0 x4 and PCIe 3.0 x4 M.2 Form Factor: 22110 M.2 Key: M-Key (RAID 0.1 support)
Dual LAN with 10GBase-T with Intel X557
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